Optical processing apparatus

ABSTRACT

An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

RELATED APPLICATIONS

This application is a divisional application of Ser. No. 10/842,418,filed May 11, 2004 as U.S. Pat. No. 7,419,085, which claims priority ofJapanese Patent application Nos. 2003-134097, filed May 13, 2003;2003-136975, filed May 15, 2003 and 2003-136976, filed May 15, 2003, thecontents of which are herewith incorporated by reference.

FIELD OF THE INVENTION

The present invention relates to a optical processing apparatus forprocessing by utilizing light energy.

BACKGROUND OF THE INVENTION

Hitherto, a optical processing apparatus comprises light energy outputmeans for producing light energy, a first optical path for guiding thelight energy into a work, optical means disposed in the first opticalpath for shaping the light energy, a second optical path sharing part ofthe first optical path for guiding the light from the work to photoreceiving means, and driving means for changing the relative positionsof at least the optical means and work.

Such conventional processing apparatus by light energy is disclosed inJapanese Laid-open Patent No. 2002-1521.

SUMMARY OF THE INVENTION

A optical processing apparatus comprising:

light energy output means for producing light energy;

a first optical path for guiding the light energy into a work;

optical means disposed in the first optical path for shaping the lightenergy;

a second optical path sharing part of the first optical path for guidingthe light from the work to photo receiving means; and

driving means for changing the relative positions of at least theoptical means and work,

in which a judging part of a color different from deposits sticking tothe optical means is provided, and the optical means is positioned atthe judging part, and the photo receiving means detects the stickingstatus of deposits to the optical means.

A optical processing apparatus comprising:

light energy output means for producing light energy;

a first optical path for guiding the light energy into a work;

optical means disposed in the first optical path for shaping the lightenergy;

a second optical path sharing part of the first optical path for guidingthe light from the work to photo receiving means, driving means forchanging the relative positions of at least the optical means and work;

wire solder feed means for feeding a wire solder closely to a processingposition of the work;

leading end shape detecting means for detecting the shape of leading endportion of the wire solder; and

solder fusing part heating means disposed at a position different fromthe processing position for heating the solder fusing part, in which thedriving means moves the leading end of the wire

solder to the solder fusing part when the leading end portion of thewire solder is not needed, and the light energy is emitted to theleading end portion of the wire solder.

A optical processing apparatus comprising:

light energy output means for producing light energy;

a first optical path for guiding the light energy into a work;

optical means disposed in the first optical path for shaping the lightenergy;

a second optical path sharing part of the first optical path for guidingthe light from the work to photo receiving means;

driving means for changing the relative positions of at least theoptical means and work;

wire solder feed means for feeding a wire solder closely to a processingposition of the work; and

wire solder leading end position detecting means for detecting at leastthe position of leading end portion of the wire solder, and detectingfailure of soldering when the leading end portion of the wire solder isnot positioned at the processing position.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic explanatory diagram in exemplary embodiment 1 ofthe invention.

FIG. 2 is a schematic explanatory diagram in exemplary embodiment 2 ofthe invention.

FIG. 3 is a schematic explanatory diagram in exemplary embodiment 3 ofthe invention.

FIG. 4 is a schematic explanatory diagram in exemplary embodiment 4 ofthe invention.

FIG. 5 is a schematic explanatory diagram in exemplary embodiment 5 ofthe invention.

FIG. 6 is a schematic explanatory diagram in exemplary embodiment 6 ofthe invention.

FIG. 7 is a schematic explanatory diagram in exemplary embodiment 7 ofthe invention.

FIG. 8 is an explanatory diagram showing the relation when deposits andbackground are same in color.

FIG. 9 is an explanatory diagram showing the relation when deposits andbackground are different in color.

FIG. 10 is an explanatory diagram in exemplary embodiment 8 of theinvention.

FIG. 11 is an explanatory diagram in exemplary embodiment 9 of theinvention.

FIG. 12 is an explanatory diagram in exemplary embodiment 10 of theinvention.

FIG. 13 is an explanatory diagram in exemplary embodiment 11 of theinvention.

FIG. 14 is an explanatory diagram in exemplary embodiments 12 and 13 ofthe invention.

FIG. 15 is an explanatory diagram in exemplary embodiment 14 of theinvention.

FIG. 16 is an explanatory diagram in exemplary embodiment 15 of theinvention.

FIG. 17 is an explanatory diagram in exemplary embodiment 16 of theinvention.

FIG. 18 is an explanatory diagram in exemplary embodiment 17 of theinvention.

FIG. 19 is an explanatory diagram when the wire solder leading end shapeis in normal state.

FIG. 20A is an explanatory diagram when the wire solder leading endshape is in abnormal state.

FIG. 20B is an explanatory diagram when the wire solder leading endshape is in abnormal state.

FIG. 20C is an explanatory diagram when the wire solder leading endshape is in abnormal state.

FIG. 20D is an explanatory diagram when the wire solder leading endshape is in abnormal state.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

However, in the detecting method of sticking state of deposits in theconventional optical processing apparatus, if a same color as depositssticking to the optical means is present in a position of background ofthe optical means, the sticking status cannot be detected accurately.

The invention is devised to detect the sticking status accurately if asame color as deposits sticking to the optical means is present in aposition of background of the optical means. Examples of the inventionare described in exemplary embodiments 1 to 7 below.

Exemplary Embodiment 1

A first exemplary embodiment of the invention is described below whilereferring to FIGS. 1, 8, and 9. Light energy output means 101 produceslight energy as processing energy source. A first optical path 102 oflight energy guides the light energy into a work 106. A half mirror 103has a characteristic of transmitting wavelength components of lightenergy and reflecting visible light components. Optical means 104 shapesthe light energy, and focuses the light emitted from the light energyoutput means 101 into a light of required beam diameter. Its focusingcharacteristic is determined in conformity to the divergent property oflight from the light energy output means 101. A detachable protectiveglass 105 prevents foreign matter of processing from sticking to theoptical means 104. By replacing it when the light energy output islowered due to foreign matter deposits, the optical output is recovered,and the maintenance is facilitated. The work 106 is the object ofprocessing in this apparatus. A mirror 107 guides the light reflectedfrom the work 106 into photo receiving means. Photo receiving means 108detects the light reflected from the work 106 as an image of the work.An optical path 109 is an optical path of the photo receiving means. Theblock from the light energy output means 101 to the optical path 109 iscalled a processing head. Driving means 110 changes relative positionsof the work 106 and deposit judging part 111 and processing head. Thedeposit judging part 111 of plural different colors can judge thedeposits.

In the optical processing apparatus having such configuration, theoperation is described below.

Light emitted from the light energy output means 101 passes the halfmirror 3 by way of the first optical path 102, and enters the opticalmeans 4. This light is focused into a necessary size, and is emitted tothe work 106 by way of the protective glass 105, and the work 106 ismachined by the focused light.

On the other hand, the light reflected by the work 106 propagates thesecond optical path 109 by way of the protective glass 105, opticalmeans 104, and half mirror 103. The light is reflected again by themirror 107, and enters the photo receiving means 108.

The driving means 110 can change the relative positions of the work 106,deposit judging part 111, and processing head. On the basis of the imageinformation of the work 106 obtained from the photo receiving means 108,the processing head is moved to the processing position of the work 106by the driving means 110, and a light beam is emitted from theprocessing head and processing is done.

If the work and deposits are of same color, if attempted to detectdeposits at the processing position, it is hard to distinguish thedeposits as shown in FIG. 8. Therefore, to detect the deposits in thebackground of a different color from the deposits, in deposits detectionoperation of the protective glass 105, the color of the work 106 isdetected, and the processing head is moved by the driving means 110 tothe deposits judging part 111 of a most different color from thedeposits sticking to the protective glass 105. Then the photo receivingmeans 108 detects the sticking status of deposits.

Deposits can be roughly predicted from the work 106 or processingprocess (soldering, cutting, etc.), and the deposits judging part 111 isdetermined accordingly. Not limited to a single detection of deposits,by continuing detection by moving sequentially to deposits detectingparts 111 of different colors, deposits of plural colors can be detectedeffectively.

By this configuration, processing is possible regardless of processingposition of the work or the location of the deposits judging part.

Specific examples of light energy include laser and lamp, the photoreceiving means is realized by camera, and the image correcting means isa lens.

Thus, in the conventional method of detecting the sticking status ofdeposits, in the location of same color as the deposits sticking to theoptical means, the sticking status cannot be detected accurately. Bycontrast, in the exemplary embodiment, deposits judging parts 111 ofplural different colors are provided, and judging from the color of thework 106, by moving the positions sequentially from the judging part ofthe most different color from the deposits sticking to the optical means104, the sticking status of deposits to the optical means 104 can beeasily detected by the photo receiving means 108.

Exemplary Embodiment 2

A second exemplary embodiment of the invention is described below whilereferring to FIG. 2.

In FIG. 2, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted.

What is characteristic of this exemplary embodiment is that thesemembers are disposed at the lower side (the direction of gravity) of thework 106.

In the optical processing apparatus thus configured, the operation isexplained. Light emitted from the light energy output means 101 passesthe half mirror 103 along the first optical path 102, and enters theoptical means 104. This light is focused into a necessary size, and isemitted to the work 106 by way of the protective glass 105. The work 106is machined by this focused light. The light reflected by the work 106passes through the protective glass 105 and optical means 104, and isreflected by the half mirror 103 to get into the second optical path109, and is reflected again by the mirror 107, and enters the photoreceiving means 108. This area is called the processing head, and isinstalled at the lower side of the work, and the lower side of the work106 can be machined.

Therefore, if the processing side of the work 106 is at the lower side,it is not required to invert the work 106, and inverting device is notneeded. Hence, it is free from risk of dislocation due to inversion ofthe work 106 or dropping of the work or parts mounted thereon.

Exemplary Embodiment 3

A third exemplary embodiment of the invention is described below whilereferring to FIG. 3.

In FIG. 3, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted.

What is characteristic of this exemplary embodiment is that thesemembers are disposed at the lower side (the direction of gravity) of thework 106, and that it further comprises display means 112 for displayingthe image of the work 106 obtained by the photo receiving means 108,recognition means 113 for detecting the position of the processing headfor leading out the processing position, and processing positiondetecting means 114 for leading out the processing position. In thisexemplary embodiment, if the processing side of the work 106 is at thelower side, it is not required to invert the work 106, and invertingdevice is not needed. Hence, it is free from risk of dislocation due toinversion of the work 106 or dropping of the work or parts mountedthereon.

Moreover in this exemplary embodiment, the processing position detectingmeans 114 detects the position of light beam emitted from the processinghead on the basis of the information from the processing head positionrecognition means 113. This signal is sent to the display means 112, andis displayed as an image. The image of the work 106 is converted into anelectric signal by the photo receiving means 108, and is displayed as animage of processing position of the work 106 by the display means 112.

Accordingly, if the processing area is small, or the processing area isat the lower side of the work and is hard to recognize visually, it canbe observed easily, or if the position is deviated, it can be easilydetected.

The processing position detecting means 114 is, for example, a computer,and the display means 112 is a CRT or LCD display device.

Having such display means 112, if the processing side is at the lowerside of the work 106 and is hard to recognize visually, positionteaching or correction confirmation may be easily done. Further, bydisplaying the image of the work 106 and the present light beam positionin the display means 112, the location of the present light beam in thework or the processing position can be easily known. Also because ofoff-line teaching, the position can be taught without stopping theproduction line.

Exemplary Embodiment 4

A fourth exemplary embodiment of the invention is described below whilereferring to FIG. 4.

In FIG. 4, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted.

What is characteristic of this exemplary embodiment is that thesemembers are disposed at the lower side (the direction of gravity) of thework 106, and that it further comprises display means 112 for displayingthe image of the work 106 obtained by the photo receiving means 108,recognition means 113 for detecting the position of the processing headfor leading out the processing position, processing position detectingmeans 114 for leading out the processing position, and processingposition detection correcting means 115.

In the optical processing apparatus thus configured, the operation isexplained below.

In this exemplary embodiment, if the processing side of the work 106 isat the lower side, it is not required to invert the work 106, andinverting device is not needed. Hence, it is free from risk ofdislocation due to inversion of the work 106 or dropping of the work orparts mounted thereon.

Moreover in this exemplary embodiment, the processing position detectingmeans 114 detects the position of light beam emitted from the processinghead on the basis of the information from the processing head positionrecognition means 113. This signal is sent to the display means 112, andis displayed as an image. The image of the work 106 is converted into anelectric signal by the photo receiving means 108, and is displayed as animage of processing position of the work 106 by the display means 112.Herein, the processing position detection correcting means 115 detectsthe difference between the position of processing area of the work 106by the photo receiving means 108 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 114. The processing position detecting means114 positions the processing head by compensating so as to eliminate theposition error by the driving means 110 on the basis of this errorposition information, and processing is started by manipulating theoutput means 101 of the processing head.

The processing head position recognizing means is realized, for example,by an encoder of driving means, and the position detection correctingmeans is an image recognition device.

Thus, by correcting the difference of the emitting position of lightbeam and processing position of the work 106 by the driving means 110,the processing precision can be enhanced.

Exemplary Embodiment 5

A fifth exemplary embodiment of the invention is described below whilereferring to FIG. 5.

In FIG. 5, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted. What is characteristic of this exemplary embodiment is thatthese members are disposed at the lower side (the direction of gravity)of the work 106, and that it further comprises display means 112 fordisplaying the image of the work 106 obtained by the photo receivingmeans 108, recognition means 113 for detecting the position of theprocessing head for leading out the processing position, processingposition detecting means 114 for leading out the processing position,processing position detection correcting means 115, and image memorymeans 116.

In the optical processing apparatus thus configured, the operation isexplained below.

In this exemplary embodiment, if the processing side of the work 106 isat the lower side, it is not required to invert the work 106, andinverting device is not needed. Hence, it is free from risk ofdislocation due to inversion of the work 106 or dropping of the work orparts mounted thereon.

Moreover in this exemplary embodiment, the processing position detectingmeans 114 detects the position of light beam emitted from the processinghead on the basis of the information from the processing head positionrecognition means 113. This signal is sent to the display means 112, andis displayed as an image. The image of the work 106 is converted into anelectric signal by the photo receiving means 108, and is displayed as animage of processing position of the work 106 by the display means 112.Herein, the processing position detection correcting means 115 detectsthe difference between the position of processing area of the work 106by the photo receiving means 108 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 114. The processing position detecting means114 positions the processing head by compensating so as to eliminate theposition error by the driving means 110 on the basis of this errorposition information, and processing is started by manipulating theoutput means 101 of the processing head.

The image memory means 116 stores image data of the work 106. The imagememory means 116 displays its image in the display means 112. Thepresent light beam emitting position is also displayed in the displaymeans 112 by means of the processing position detecting means 114.

Specific examples of image data include CAD data, scanner image, andcamera image.

By the image memory means 116 for preliminarily storing the imageshowing the processing area, it is easy to move to the processing area.

Exemplary Embodiment 6

A sixth exemplary embodiment of the invention is described below whilereferring to FIG. 6.

In FIG. 6, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted.

What is characteristic of this exemplary embodiment is that thesemembers are disposed at the lower side (the direction of gravity) of thework 106, and that it further comprises display means 112 for displayingthe image of the work 106 obtained by the photo receiving means 108,recognition means 113 for detecting the position of the processing headfor leading out the processing position, processing position detectingmeans 114 for leading out the processing position, processing positiondetection correcting means 115, image memory means 116, and a wiresolder feed device 117 for feeding a wire solder to the processing area.

In the optical processing apparatus thus configured, the operation isexplained below.

In this exemplary embodiment, if the processing side of the work 106 isat the lower side, it is not required to invert the work 106, andinverting device is not needed. Hence, it is free from risk ofdislocation due to inversion of the work 106 or dropping of the work orparts mounted thereon.

Moreover, the processing position detecting means 114 detects theposition of light beam emitted from the processing head on the basis ofthe information from the processing head position recognition means 113.This signal is sent to the display means 112, and is displayed as animage. The image of the work 106 is converted into an electric signal bythe photo receiving means 108, and is displayed as an image ofprocessing position of the work 106 by the display means 112. Herein,the processing position detection correcting means 115 detects thedifference between the position of processing area of the work 106 bythe photo receiving means 108 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 114. The processing position detecting means114 positions the processing head by compensating so as to eliminate theposition error by the driving means 110 on the basis of this errorposition information, and processing is started by manipulating theoutput means 101 of the processing head.

The image memory means 116 stores image data of the work 106. The imagememory means 116 displays its image in the display means 112. Thepresent light beam emitting position is also displayed in the displaymeans 112 by means of the processing position detecting means 114.

Specific examples of image data include CAD data, scanner image, andcamera image.

Exemplary Embodiment 7

A seventh exemplary embodiment of the invention is described below whilereferring to FIG. 7.

In FIG. 7, the processing head comprising the light energy output means101 to optical path 109, the driving means 110, and the deposits judgingpart 111 are same as in exemplary embodiment 1, and the explanation isomitted.

What is characteristic of this exemplary embodiment is that thesemembers are disposed at the lower side (the direction of gravity) of thework 106, and that it further comprises display means 112 for displayingthe image of the work 106 obtained by the photo receiving means 108,recognition means 113 for detecting the position of the processing headfor leading out the processing position, processing position detectingmeans 114 for leading out the processing position, processing positiondetection correcting means 115, image memory means 116, a wire solderfeed device 117 for feeding a wire solder to the processing area, andimage distortion compensating means 118 for compensating the imagedistorted the optical means 104.

In the optical processing apparatus thus configured, the operation isexplained below.

In this exemplary embodiment, if the processing side of the work 106 isat the lower side, it is not required to invert the work 106, andinverting device is not needed. Hence, it is free from risk ofdislocation due to inversion of the work 106 or dropping of the work orparts mounted thereon.

Moreover, the processing position detecting means 114 detects theposition of light beam emitted from the processing head on the basis ofthe information from the processing head position recognition means 113.This signal is sent to the display means 112, and is displayed as animage. The image of the work 106 is converted into an electric signal bythe photo receiving means 108, and is displayed as an image ofprocessing position of the work 106 by the display means 112. Herein,the processing position detection correcting means 115 detects thedifference between the position of processing area of the work 106 bythe photo receiving means 108 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 114. The processing position detecting means114 positions the processing head by compensating so as to eliminate theposition error by the driving means 110 on the basis of this errorposition information, and processing is started by manipulating theoutput means 101 of the processing head.

The image memory means 116 stores image data of the work 106. The imagememory means 116 displays its image in the display means 112. Thepresent light beam emitting position is also displayed in the displaymeans 112 by means of the processing position detecting means 114.

Specific examples of image data include CAD data, scanner image, andcamera image.

Thus, by the image distortion compensating means 118 disposed before thephoto receiving means 108, a distortion-free image of the work 106 canbe obtained in the photo receiving means 108. As a result, deviation ofprocessing position or size of light focusing diameter can be easilyknown, and the teaching time is shortened and processing of highprecision is realized. As described in the foregoing exemplaryembodiments, according to the invention, the sticking status of depositscan be detected more accurately than in the prior art, and the moreaccurate processing is possible than in the prior art.

Incidentally, in the conventional optical processing apparatus and theproduction facility using the same, if the wire solder is not suppliednormally, the worker visually detects defective soldering after thesoldering process, and stops the operation manually. At this time, theworker cuts of f the wire solder manually, and restarts the operationmanually.

Yet, detection timing of defective feed of wire solder occurs oftenafter occurrence of defective soldering, and the soldering process mustbe repeated, and an extra step takes place every time.

The invention presents a optical processing apparatus capable of solvingsuch problems in the conventional optical processing apparatus. Anexample of the invention is explained in exemplary embodiment 8.

The invention prevents defective soldering from occurring. If theprocessing side is at the lower side of the work, it is not required toinvert the work. While holding the wire solder leading end in a normalstate and also other positions in normal state, a stable solderingprocess of high quality can be continued. Further according to theinvention, position teaching and correction confirmation can be doneeasily. If the positioning precision of the work is poor, a highprecision of processing position is obtained. Moreover, since theprocessing area can be taught while observing the image of the work,off-line teaching is possible. The image distortion is small, and theprecision is not lowered in the case of teaching, confirming thecorrection, or recognizing and compensating.

Exemplary Embodiment 8

An eighth exemplary embodiment of the invention is described below whilereferring to FIG. 10.

Output means 201 produces a light energy. A first optical path 202 showsan optical path of the light energy for guiding the light energy to thework. A half mirror 203 has a function of transmitting wavelengthcomponents of light energy, and reflecting visible ray components.Optical means 204 shapes the light energy, and focuses the light emittedfrom the light energy output means 201 into a necessary beam diameter.Its focusing characteristic is determined depending on the divergentcharacteristic of the light energy. A protective glass 205 isdetachable, and prevents foreign matter generated in processing fromsticking to the optical means 204. If the light energy output is lowereddue to deposits of foreign matter, it is replaced and the optical outputis recovered, and the maintenance is facilitated. A work 206 is theobject of processing of this apparatus. A mirror 207 guides the light ofthe work to photo receiving means 208. The photo receiving means 208 ismeans for viewing the image of the work. A second optical path 209 showsan optical path of the photo receiving means 208. A processing head iscomposed of these elements from the light energy output mean 201 to thesecond optical path 209.

Driving means 210 changes relative positions of the work 206 and opticalmeans 204. First moving means 212 moves the processing head in thevertical direction of the work 206. Second moving means 213 moves a wiresolder feed device 211 in the vertical direction of the work 206. Thirdmoving means 214 moves the wire solder feed device 211 in the lateraldirection of the work 206. Fourth moving means 215 moves the wire solderfeed device 211 in a direction of drawing an arc of the work 206.Display means 216 displays the image of the work 206 obtained from thephoto receiving means 208.

Recognition means 217 detects the position of the processing head.Processing position detecting means 218 detects the position of lightbeam emitted from the processing head on the basis of the information ofthe processing head position recognition means 217. Processing positiondetection correcting means 219 detects the difference between theposition of processing area of the work 206 by the photo receiving means208 and the position of light beam emitted from the processing head, andsends the information to the processing position detecting means 218.Image memory means 220 stores image data of the work 206. Imagedistortion compensating means 221 is disposed between the mirror 207 andphoto receiving means 208 in order to compensate the image distorted bythe optical means 204.

Leading end shape detecting means 222 detects the leading end shape ofwire solder. A solder fusing part 223 is a position for discardingunnecessary portion and fusing and sticking as solder in order to keepthe solder leading end portion in an appropriate state. A droppreventive part 224 is a part for preventing drop of unnecessary solderprovided at the lower side in the direction of gravity to the solderfusing part 223.

In the optical processing apparatus thus configured, the operation isexplained.

First of all, light emitted from the light energy output means 201passes the half mirror 203 along the first optical path 202, and entersthe optical means 204, in which this light is focused into a necessarysize, and is emitted to the work 206 by way of the protective glass 205.The work 206 is machined by this focused light. The light reflected bythe work 206 passes through the protective glass 205 and optical means204, and is reflected by the half mirror 203 to get into the secondoptical path 209, and is reflected again by the mirror 207, and entersthe photo receiving means 208 by way of the image distortioncompensating means 221.

In processing, the driving means 210 moves the processing head and thework 206 relatively, and positions the light beam to the processingarea.

The wire solder feed means 211 feeds the solder to the heatedirradiation position and performs soldering when the light beam isemitted to the specified position of the work by the processing head. Atthis time, the first moving means 212 adjusts the irradiation diameterdepending on the work, and the second moving means 213 and third movingmeans 214 adjust the wire solder feed position depending on the changeof irradiation diameter. Further, the fourth moving means 215 adjuststhe wire solder feed position 211 so that the wire solder feed means 211may not interfere with the side wall or the like in the apparatusdepending on the shape of the work 206.

The processing position detecting means 218 detects the position of thelight beam emitted from the processing head on the basis of theinformation of the processing head position recognition means 217, andthis signal is sent to the display means 216, and displayed as an image.The image of the work 206 is converted into an electric signal by thephoto receiving means 208, and is displayed as the image of theprocessing area of the work 206 by the display means 216.

The processing position detecting means 218 detects the position of thelight beam emitted from the processing head on the basis of theinformation of the processing head position recognition means 217. Thissignal is sent to the display means 216, and is displayed as an image.The image of the work 206 is converted into an electric signal by thephoto receiving means 208, and is displayed as the image of theprocessing area of the work 206 by the display means 216. Herein, theprocessing position detection correcting means 219 detects thedifference between the position of processing area of the work 206 bythe photo receiving means 208 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 218. The processing position detecting means218 positions the processing head so as to eliminate the position errorby the driving means 210 on the basis of this error positioninformation, and processing is started by manipulating the light energyoutput means 201 of the processing head.

The leading end shape detecting means 222 judges the leading end shapeof wire solder. If judged to be abnormal, the driving means 210 movesthe wire solder leading end portion to the solder fusing part, and lightbeam is emitted by the light energy output means 201, and the solderfusing part 223 is heated over the solder melting point. Consequently,the wire solder feed means 211 feeds the wire solder, and presses to thesolder fusing part, and an unnecessary portion of leading end is fusedand adhered to the solder fusing part 223. At this time, if the wiresolder leading end falls down, it is received by the unnecessary solderdrop preventive part 224, and hence it does not stick to the protectiveglass or the like. In this way, while keeping the wire solder leadingend in normal state and other parts also in normal state, stablesoldering process of high quality can be continued.

The light beam may be emitted anywhere as far as above the solder fusingpart, and the waste solder can be fused by its heat conduction, and itis also possible to prevent the light beam from being emitted to theunnecessary solder drop preventive part 224. Further, by using amaterial capable of transmitting the light beam in the unnecessarysolder drop preventive part 224, effects of heat can be prevented.

Further, if the processing side of the work 206 is at the lower side, itis not required to invert the work 206, and inverting device is notneeded. Hence, it is free from risk of dislocation due to inversion ofthe work 206 or dropping of the work or parts mounted thereon.

In an abnormal state of the wire solder leading end, in particular, in afolded state, if pressing directly to the solder fusing part 223, onlythe folded part is fused, and the folded wire solder leading end mayfall down. At this time, however, it is received by the unnecessarysolder drop preventive part 224, and hence it does not stick to theprotective glass or the like. In this way, while keeping the wire solderleading end in normal state and other parts also in normal state, stablesoldering process of high quality can be continued.

The processing position detecting means 218 detects the position of thelight beam emitted from the processing head on the basis of theinformation of the processing head position recognition means 217. Thissignal is sent to the display means 216, and is displayed as an image,and the image of the work 206 is converted into an electric signal bythe photo receiving means 208, and is displayed as the image of theprocessing area of the work 206 by the display means 216. Therefore, ifthe processing area is small or the processing area is at the lower sideof the work and is hard to be recognized visually, it can be easilyobserved, and if the position is deviated, it can be recognized easily.

Further, by the image distortion correcting means 221 disposed beforethe photo receiving means 208, the image distortion can be suppressed,and the precision is not lowered at the time of teaching, checkingcorrection or compensating recognition. Thus, according to theinvention, by emitting light beam, the solder fusing part can be heatedover the solder melting point, and the unnecessary portion of theleading end can be fused and adhered to the solder fusing part.Therefore, without requiring any particular heating device, and withoutspace limitation, the wire solder leading end can be kept in normalstate while saving the cost, and stable soldering process of highquality can be continued.

In the conventional optical processing apparatus described above, thesolder feed method for soldering is not designed to detect the positionof the solder leading end at the processing area of the work, and thesolder is supplied for a predetermined solder feed time and at feedspeed, whether the leading end of the solder is short or long for theprocessing area. Hence, a proper amount of solder is not supplied forthe processing area, and excessive soldering or insufficient solderingoccurs, and it is hard to assure the quality.

The invention is intended to present a optical processing apparatus forsolving such problems, and examples are explained below by referring toexemplary embodiments 9 to 17.

Exemplary Embodiment 9

A ninth exemplary embodiment of the invention is described below whilereferring to FIGS. 11, 19, 20A, 20B, 20C, and 20D.

Light energy output means 301 is a processing energy source forproducing a light energy. A first optical path 302 shows an optical pathof the light energy for guiding the light energy to the work. A halfmirror 303 has a function of transmitting wavelength components of lightenergy, and reflecting visible ray components. Optical means 304 shapesthe light energy, and focuses the light emitted from the light energyoutput means 201 into a necessary beam diameter. Its focusingcharacteristic is determined depending on the divergent characteristicof the light energy source. A detachable protective glass 305 preventsforeign matter generated in processing from sticking to the opticalmeans 304. If the light energy output is lowered due to deposits offoreign matter, by replacing the protective glass 105, the opticaloutput is recovered, and the maintenance is facilitated. A work 306 isthe object of processing of this apparatus. A mirror 307 guides thelight of the work to photo receiving means 308. The photo receivingmeans 308 is means for viewing the image of the work and the leading endportion of the wire solder. A second optical path 309 shows an opticalpath of the photo receiving means 308. A processing head is composed ofthese elements from the light energy output mean 301 to the secondoptical path 309. Driving means 310 changes relative positions of thework 306 and optical means 304. A wire solder feed device 311 feeds awire solder. Leading end shape detecting means 312 detects the shape ofleading end of wire solder.

In the optical processing apparatus thus configured, the operation isexplained.

First of all, light emitted from the light energy output means 301passes the half mirror 303 along the first optical path 302, and entersthe light energy shaping means 304. Herein, this light is focused into anecessary size, and is emitted to the work 306 by way of the protectiveglass 305. The work 306 is machined by this focused light. The lightreflected by the work 306 passes through the protective glass 305 andoptical means 304, and is reflected by the half mirror 303 to get intothe second optical path 309, and is reflected again by the mirror 307,and enters the photo receiving means 308. For local heating by focusingthe light energy, driving means 310 is provided for relatively movingthe processing head and the work, while suppressing heat effects on thework, and hence the processing region can be expanded. Also by the wiresolder feed means 311, the light beam can be emitted to the specifiedposition of the work by the processing head, and the solder is suppliedinto the heated irradiation position, and thereby soldering can beexecuted. Before or after soldering in the processing position, theleading end shape detecting means 312 judges the leading end of thesolder 314 supplied from the wire solder nozzle 313, determines normalwhen it is as shown in FIG. 19. On the other hand, if the leading end ofthe solder 314 is as shown in any one of FIG. 20A to FIG. 20D, theleading end shape detecting means 312 judges the position is notappropriate, and detects solder failure.

By this constitution, a proper amount of solder can be supplied, andexcessive solder and solder failure can be prevented, and the solderingcondition suited to the work is realized, and soldering of high qualityis executed.

For example, the light energy is laser or lamp, the photo receivingmeans is camera, the leading end shape detecting means is imagerecognition device, and image compensating means is lens.

Exemplary Embodiment 10

A tenth exemplary embodiment of the invention is described below whilereferring to FIG. 12.

In FIG. 12, the structure from the light energy output means 301 to thesolder 314 is same as in exemplary embodiment 9, and the explanation isomitted.

In this exemplary embodiment, the processing head is disposed at thelower in the acting direction of gravity on the work 306, and isdesigned to machine the lower side of the work 306.

By this constitution and configuration, if the processing side of thework 306 is at the lower side, it is not required to invert the work306, and inverting device is not needed, and hence, it is free from riskof deviation of position due to inversion of the work 306 or dropping ofthe work or parts mounted thereon.

Exemplary Embodiment 11

An eleventh exemplary embodiment of the invention is described belowwhile referring to FIG. 13.

In FIG. 13, the structure from the light energy output means 301 to thesolder 314 is same as in exemplary embodiment 9, and the explanation isomitted.

This exemplary embodiment further comprises display means 315 fordisplaying the image of the work 306 obtained by the photo receivingmeans 308, recognition means 316 detecting the position of theprocessing head, and processing position detecting means 317.

The processing position detecting means 317 detects the position oflight beam emitted from the processing head on the basis of theinformation from the processing head position recognition means 316.This signal is sent to the display means 315, and is displayed as animage. The image of the work 306 is converted into an electric signal bythe photo receiving means 308, and is displayed as an image ofprocessing position of the work 306 by the display means 315.Accordingly, if the processing area is small, or the processing area isat the lower side of the work and is hard to recognize visually, it canbe observed easily by this displayed image, or if the position isdeviated, it can be easily detected, and position teaching or correctionconfirmation may be easily done.

For example, the processing position detecting means is computer, andthe display means is CRT or LCD display device.

Exemplary Embodiment 12

A twelfth exemplary embodiment of the invention is described below whilereferring to FIG. 14.

In FIG. 14, the structure from the light energy output means 301 to theprocessing position detecting means 317 is same as in exemplaryembodiment 11, and the explanation is omitted.

This exemplary embodiment further comprises position detectioncorrecting means 318.

In the optical processing apparatus thus configured, the operation isexplained below. The processing position detecting means 317 detects theposition of light beam emitted from the processing head on the basis ofthe information from the processing head position recognition means 316.This signal is sent to the display means 315, and is displayed as animage. The image of the work 306 is converted into an electric signal bythe photo receiving means 308, and is displayed as an image ofprocessing position of the work 306 by the display means 315. Herein,the processing position detection correcting means 318 detects thedifference between the position of processing area of the work 306 bythe photo receiving means 308 and the position of light beam emittedfrom the processing head, and sends the information to the processingposition detecting means 317. The processing position detecting means317 positions the processing head by compensating so as to eliminate theposition error by the driving means 310 on the basis of this errorposition information, and processing is started by manipulating thelight energy output means 301 of the processing head. By such positiondetection and correction motion, if the positioning precision of thework is low, the processing position precision can be assured.

For example, the processing head position recognition means is encoderof driving means, and the position detection correcting means is imagerecognition device.

Exemplary Embodiment 13

A thirteenth exemplary embodiment of the invention is described belowwhile referring to FIG. 14.

In FIG. 14, the structure from the light energy output means 301 to theposition detection correcting means 318 is same as in exemplaryembodiment 12, and the explanation is omitted.

This exemplary embodiment further comprises image memory means 319.

In the optical processing apparatus thus configured, the operation isexplained below. The processing position detecting means 317 detects theposition of light beam emitted from the processing head on the basis ofthe information from the processing head position recognition means 316.This signal is sent to the display means 315, and is displayed as animage. The image of the work 306 is converted into an electric signal bythe photo receiving means 308, and is displayed as an image ofprocessing position of the work 306 by the display means 315. Theprocessing head is installed in an acting direction of gravity on thework 306, and relative positions of the processing head and the work 306can be changed by the driving means 310. Image data of the work 306 isstored in the image memory means 317. The image memory means 317displays the image in the display means 313. The present light beamemitting position is also displayed in the display means 313 by theprocessing position detecting means 315. By this image memory means, theprocessing position can be taught off-line while observing the image ofthe work.

Specific examples of image data include CAD data, scanner image, andcamera image.

Exemplary Embodiment 14

A fourteenth exemplary embodiment of the invention is described belowwhile referring to FIG. 15.

In FIG. 15, the structure from the light energy output means 301 to theimage memory means 319 is same as in exemplary embodiment 13, and theexplanation is omitted.

This exemplary embodiment further comprises image distortion correctingmeans 320 for compensating the image distorted by the optical means 304provided between the mirror 307 and photo receiving means 308.

In the optical processing apparatus thus configured, the operation isexplained below. The light coming out from the work 306 passes throughthe protective glass 305 and optical means 304, and is reflected by thehalf mirror 303 to get into the second optical path 309, and isreflected again by the mirror 307, and gets into the photo receivingmeans 308 by way of the image distortion correcting means 320. By theimage distortion correcting means 320 disposed before the photoreceiving means 308, distortion of image can be suppressed, and theprecision is not lowered at the time of teaching, display confirmationor recognition compensation.

Exemplary Embodiment 15

A fifteenth exemplary embodiment of the invention is described belowwhile referring to FIG. 16.

In FIG. 16, the structure from the light energy output means 301 to theimage distortion correcting means 320 is same as in exemplary embodiment14, and the explanation is omitted.

This exemplary embodiment further comprises a deposits judging part 321for judging deposits of plural different colors.

In the optical processing apparatus thus configured, the operation isexplained below. The driving means 310 can change relative positions ofthe work 306, deposits judging part 321 and the processing head, andafter moving the processing head to the deposits judging part 321,sticking status of deposits is detected by the photo receiving means308. Depending on the sticking status, by error stop before processing,the operator is warned of necessity of maintenance. Thus, the protectiveglass 305 is always in normal state during processing, and stablesoldering of high quality can be continued. For judging deposits,judging patterns of plural different colors are prepared, so thatvarious types of sticking status can be judged.

Exemplary Embodiment 16

A sixteenth exemplary embodiment of the invention is described belowwhile referring to FIG. 17.

In FIG. 17, the structure from the light energy output means 301 to thedeposits judging part 321 is same as in exemplary embodiment 15, and theexplanation is omitted.

This exemplary embodiment further comprises a solder fusing part 322 forfusing and sticking unnecessary portion as waste solder in order to keepthe solder leading end in appropriate state, and solder fusing partheating means 323 for heating the solder fusing part 322 over the soldermelting point.

In the optical processing apparatus thus configured, the operation isexplained below. The leading end shape detecting means 312 judges thestate of the leading end shape of wire solder. If judged to be abnormal,the driving means 310 moves the wire solder leading end to the solderfusing part, and moves closer to the solder fusing part 322 heated overthe solder melting point by the solder fusing part heating means 323.The wire solder feed means 311 feeds the wire solder, and presses to thesolder fusing part, and the unnecessary portion of the leading end isfused and stuck to the solder fusing part 322. At this time, the solderfusing part may be heated beforehand, or may be heated quickly only whenrequired to heat over the melting point.

Thus, the leading end state of the wire solder may be always kept innormal state, and stable soldering of high quality can be continued.

Exemplary Embodiment 17

A seventeenth exemplary embodiment of the invention is described belowwhile referring to FIG. 18.

In FIG. 18, the structure from the light energy output means 301 to thesolder fusing part heating means 323 is same as in exemplary embodiment16, and the explanation is omitted.

This exemplary embodiment further comprises an undesired solder droppreventive part 324.

In the optical processing apparatus thus configured, the operation isexplained below. When the leading end of the wire solder is in abnormalstate, and in particular when folded, if it is directly fitted to thesolder fusing part 322, only the folded portion is fused, and the foldedleading end of the wire solder may drop. It is received by the undesiredsolder drop preventive part 324, and hence it is not stuck tot heprotective glass or the like. Thus, while keeping the leading end of thewire solder in normal state and also keeping other parts in normalstate, stable soldering of high quality can be continued.

As explained in the exemplary embodiments, the invention can detect theposition of leading end portion of wire solder, so that a proper amountof solder can be supplied, and excessive soldering or solder failure canbe prevented, and the soldering condition suited to the work can berealized, and soldering of high quality can be performed.

1. An optical processing apparatus comprising: a light source configuredto produce light energy; a first optical path for guiding the lightenergy into a work; an optical device disposed in the first optical pathfor shaping the light energy; a second optical path sharing part of thefirst optical path for guiding the light energy from the work to a photoreceiving device; a driving device configured to change the relativepositions of at least the optical device and the work; and a judgingpart of plural different colors arranged at a position different fromthe work, wherein: the photo receiving device detects a color of thework, the photo receiving device detects the color difference betweenthe color of the work and each of the plural different colors of thejudging part, the driving device moves the optical device to the judgingpart of a color out of the plural different colors which is differentfrom the detected color of the work, and the optical device shapes thelight energy which is guided into the judging part.
 2. The opticalprocessing apparatus of claim 1, wherein a processing head holding atleast the optical device, the second optical path and photo receivingdevice is disposed in an acting direction of gravity on the work.
 3. Theoptical processing apparatus of claim 1, further comprising: displaymeans for displaying at least the image of the processing area of thework; and processing position detecting means for leading out theposition of the work where the light energy is located when the lightenergy shaped at least by the optical device is emitted to the work,wherein the display means displays the processing position led out bythe processing position detecting means corresponding to the processingarea of the work.
 4. The optical processing apparatus of claim 3,wherein the processing position detecting means comprises: means forrecognizing the position of a processing head for holding at least theoptical device, the second optical path and the photo receiving device;and position detection correcting means for compensating the differencebetween the position of the work where the light energy is located whenthe light energy shaped by the optical device is emitted to the work andthe position detected by the recognizing means.
 5. The opticalprocessing apparatus of claim 3, further comprising memory means forstoring preliminarily the image showing the processing area of the work.6. The optical processing apparatus of claim 1, further comprising wiresolder feeding means for feeding a wire solder tote vicinity of theprocessing area of the work.
 7. The optical processing apparatus ofclaim 1, further comprising image distortion correcting means positionedat the second optical path and different from the first optical path,and positioned before the photo receiving device.